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S04-50

Products » Laser Cutting Machine >> S04-50

Product Features
S04-50 laser slicer adopts YAG laser, high speed stepping moter and controlling software researched by our company to realize slice function. It is applied mainly in silicon wafer semiconductor industry, specially suits for solar wafer cutting. It belongs to nontouch cutting and can cut many breakable goods. Comparing with other slicer UV laser slicer has many advantages as below: High output power, high slice accurancy, high speed, can cut curve and beeline, non-polution, low noise, stable function and so on.

Applications & Materials
solar wafer cutting

Technical Data

Max. Laser Average Power : 50W

Wave Length : 1064nm

Repeat Frequency : <50KHz

Cutting Area : 300mm200mm

Cutting Depth : 0.2mm

Max Cutting Speed : 100mm/s

Cutting Line Width : 0.03mm

Repeat Accuracy : 0.01mm

Input Power : 4KW

Electrical Source : 380V / 50Hz/20A

Dimensions : 1500mm650mm1150mm

Cooling System : 650mm310mm665mm

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S04-50

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