Please Install Flash Player
Download from here

FS10

Products » Laser Cutting Machine >> FS10

Product Features
Fiber silcer is the second generation of laser slicer, according to the requirement of solar siliconwafer cutting. It adopts the most advanced fiber laser. Fiber slicer has outstanding advantage in siliconwafer cutitng area, because of high quality laser, small focusing facula, noncontact cutting. In traditional mechanical cutting, silicon wafer is very easy to crack, but fiber slicer solves it, which improve the productivity and rate of finished product.

Applications & Materials
silicon wafer cutting

Technical Data

Max. Laser Average Power : 10W

Wave Length : 1064nm
Beam quality M2 <1.8

Cutting Area : 300mm300mm

Cutting Depth : 0.5mm

Max Cutting Speed : 60mm/s

Max Speed : 100mm/s

Cutting Line Width : 0.01mm

Repeat Accuracy : 0.02mm

Max Workpiece Height : 30mm

Input Power : 700W

Electrical Source : 220V / 50Hz/10A

Dimensions : 710mm570mm1245mm

Cooling System :

ENQUIRY FORM
Contact Information * fields are mandatory
Contact Person *
Company Name
Address *
Country *
Email ID *
Phone Number *
Fax
Enquiry Details
Enquiry For
Details *

FS10

ENQUIRY FORM